Welcome to Open Science
Contact Us
Home Books Journals Submission Open Science Join Us News
Dielectric Behaviour of Milled Carbon Fibre Reinforced Polysulphide Modified Epoxy Gradient Composites
Current Issue
Volume 2, 2014
Issue 3 (June)
Pages: 43-49   |   Vol. 2, No. 3, June 2014   |   Follow on         
Paper in PDF Downloads: 21   Since Aug. 28, 2015 Views: 1626   Since Aug. 28, 2015
Archana Nigrawal, Advanced Materials and Processes Research Institute Bhopal (formerly RRL Bhopal) Bhopal -462064, INDIA.
Navin Chand, Advanced Materials and Processes Research Institute Bhopal (formerly RRL Bhopal) Bhopal -462064, INDIA.
Milled carbon fibre reinforced polysulphide modified epoxy gradient composites were developed and characterized for their dielectric and DSC behaviour. It was found that dielectric constant of the composites increased with increase of milled carbon fibre content from 0.45 to 1.66 vol.% which confirmed the formation of a gradient structure in the composite. Both dielectric constant as well as loss tangent (tan ) increased with an increase of temperature. Dielectric constant data obtained for composites matched with the Maxwell Garnett model. Change in ’ values on adding milled carbon fibre is due to the modification of PSEP structure by milled carbon fibre. Dissipation factor (tan) peaks shifted towards lower temperature with increase of carbon content, which was due to the shift in Tg of PSEP. Relaxation time () determined at 80°C decreased from 3.35 x 10-5 to 2.25 x 10-5 (s) on increase of milled carbon fibre content from 0.45 to 1.66 volume percent. DSC scans also revealed the same Tg behaviour of graded composites. Storage modulus, E’, suddenly decreased after 62°C and 60.4 °C for PSEP and composite sample C having 1.66% carbon fibres respectively.
Milled Carbon, Polysulphide Modified Epoxy, Gradient, Dielectric Constant
Chand N. and Naik A., Polym.Compos. 2008, 29,736-744.
Agari Y. and Uno T.J. ,J.Appl.Polym.Sci. 1985, 30, 2225.
Bigg D.M., Polym.Eng.Sci. 1977, 17,pp.842-847.
Bigg D.M., Adv.Polym.Technol. 1984, 4, 255.
Narkis M., Lidor G., Vaxman A. , and zuri L. , J.Electrost. 1999, 47, 201-214.
Nagata K., Iwabuki H. , and Nigo H., compos. Inerfac. 1999, 6,483.
Demain A., “Thermal conductivity of polymer-chopped carbon fibre composites” PhD Dissertation, Universite Catholique de Louvain, Louvain-la-Neuve,Belgium, 1994.
King J.A., Tucker K.W., Meyers J.D., Weber E.H., Clingerman M.L. and Ambrosius K.R., polym.Compos. 2001, 22, 142.
Wilson M.S. and Busick D.N., “Composite Bipolar Plate for Electrochemical Cells”. US patent No. 6, 248, 2001, 467.
Loutfy R.O. and Hecht M., “Low cost Molded Plastic Fuel Cell Separator plate with Conductive Elements”, US patent No.6, 511, 2003, 766.
Chand N. and Nigrawal A., Bull.Mater.Sci., Indian Academy of sciences. 2008, 31(4) ,1-4.
Mehta V. and Cooper J.S.,J.Power Source. 2003, 114, 32-53.
Jia –Xiang Zhao, Carbon fibres and composites materials in HEXEL corporsation, U.S.A., Thermo setting Resin. 2001,16,44-48.
H.Hug , JDH. The Carbon fibre/Epoxy interface–A review. Compos.Sci.Technol. 1991, 41, 13-45.
Mair H.J. and Roth S. Elektrischleitende Kunststoffe, Cral Hanser Verlag, Vienna 1989.
T.A. Skotheim Handbook of conductive polymers, MarcelDekker, Basel (1986).
Chand N. and Jain D. Bull.Mater.Sci. Indian academy of sciences. 2004,27, 227-233.
Chand N. and Hashmi SAR, Indian Patent 438, 2003.
Xiao M., Sun L., J Li Y and Gong K. Polymer 2002, 43, 2245.
Linchtenecker K., Die Dielektrizitatskonstante natuarlicher and Kunstlicher Misckorper.Physikalische zeitschrift, 1926, 27, 115-158.
Maxwell-Garnett JC. Trans.Roy.Soc 1904, 203,385-420.
Rao Y., Qu Jm, Marinis T., Wong C.P. IEEE Trans.compon.Pack.Technol. 2000, 23, 680-683.
Jianwen Xu, Wong M. and Wong C.P., Electronic components and technology conference,Proceedings 2004, 54(1), 536-541.
Lingwal V., Semwal B.S. and Panwar N.S. Bull. Mater. Sci. 2003, 26, 619-625.
Paul A. and Thomas S. J.Appl.phys. 1997, 63, 247-266.
Fitzer E, HeineM.In:Bunsell A.R.,Editor.Fiber reinforcements for composite materials,composite materials series 2.Amsterdam: Elsevier,1988:73-147.
Open Science Scholarly Journals
Open Science is a peer-reviewed platform, the journals of which cover a wide range of academic disciplines and serve the world's research and scholarly communities. Upon acceptance, Open Science Journals will be immediately and permanently free for everyone to read and download.
Office Address:
228 Park Ave., S#45956, New York, NY 10003
Phone: +(001)(347)535 0661
Copyright © 2013-, Open Science Publishers - All Rights Reserved